Hyperspectral camera module

Hyperspectral camera Module

Integrated MEMS-FPI and CMOS sensor, image sensor and lens customization. Hypernano hyperspectral module is compact and can be integrated into mobile phones, IOT and other consumer electronic devices. Immediately test, can be anytime and anywhere on food, daily supplies for testing.

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Product advantages

Miniature

small size, low power consumption, easy to integrate into all kinds of consumer electronic devices.
Simple structure

compact, highly integrated, consumer level miniaturization demand.
Band programmable

wide spectrum continuous tuntable, imaging sensor is optional.

Specification

Imaging modalities	The MEMS wavelength scanning Eq
Sensor	CMOS
Dimensions (mm)	20x20x12 (excluding MIPI interface)
Weight(g)	30
Operation temperature(℃)	-10~50
FOV (°）	60
Wavelength range(nm)	400~900 (Optional)
FWHM(nm)	20~40
Break-make ratio (OD)	＞2
Central wavelength Accuracy (nm)	≤ 2
Wavelength switching rate (ms)	≤5ms
Power (mW)	＜250mw

Application Scenario

Refrigerator

Meat quality, fruits and vegetables and other material detection, freshness analysis, etc.

Washing machine

Clothing cloth material, clothing stains and other identification.

Sweeping robot

Accurately identify stains, liquid and other target objects.